Thursday, 8 October 2026 | 14:00 - 18:00
Mikrointegration und Advanced Packaging
Location:Hertz-CabinetTrack:in presence
- Microintegration
- AI
Microintegration and Advanced Packaging have been on everyone’s lips, particularly since the growing demand for bandwidth and power consumption in the latest generations of chips. Photonics can offer solutions to the challenges facing the next generations of data centres. In this session, we will provide an insight into the latest developments in this field.
1 speaker
CEO
OpTecBB e.V.
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